Radiall in the news

Pierre Gattaz of Radiall discussed sovereignty funds and the company's chip collaboration with Foxconn and Thales on BFM Business.

Pierre Gattaz, CEO of Radiall, discussed sovereignty funds and the company's chip partnership with Foxconn and Thales on BFM Business.

Radiall's EPX series connectors provide modular and expandable solutions for diverse applications, integrating various contact technologies with minimal components.

A new 250 million euro factory, Tessalia, a collaboration of Foxconn, Thales, and Radiall, will create 800 jobs and transform Le Barp.

Radiall's global employee count is projected to reach 2,776 by March 2026, representing a 17.9% increase since 2023.

Radiall will exhibit its high-performance connectivity solutions for aerospace and defense at the ILA Tradeshow 2026.

Radiall develops high-performance connectivity solutions, including connectors and cable assemblies, for quantum computing and cryogenic applications to maintain signal integrity and manage thermal challenges.

Radiall's contactless connector technology provides reliable wireless power and data transmission for industrial applications, simplifying designs and reducing maintenance.

Pierre Gattaz advocates for innovation-led growth and industrial investment over degrowth to solve environmental challenges.

Foxconn, Thales, and Radiall formed Tessalia Technology SAS in France, a •250 million joint venture for Europe's first SiP OSAT plant, aiming for mass production by 2029.

CEO Pierre Gattaz announces Radiall's expansion through a major joint venture in France to produce high-tech interconnect components for sovereignty sectors like defense and aerospace.

Radiall, Thales, and Foxconn have launched construction of a semiconductor packaging plant in Gironde to create 800 jobs and produce 100 million components yearly.

A new joint venture in France between Foxconn, Radiall, and Thales will manufacture advanced semiconductor components for industrial and defense applications by 2029.

Radiall, Foxconn, and Thales are investing over 250 million euros to build a semiconductor packaging facility in France for advanced electronic components.

Thales, Radiall, and Foxconn are partnering to build a 250 million euro semiconductor factory in France to produce high-end electronic components for critical industries.

Radiall, Thales, and Foxconn are investing 250 million euros in a new semiconductor packaging plant in Gironde to serve high-performance industrial markets.

Radiall has partnered with Thales and Foxconn to invest 250 million euros in a new French semiconductor factory for critical industrial applications.

A new joint venture called Tessalia is building a 250 million euro semiconductor assembly plant in France to serve high-tech industrial sectors.

Radiall, Thales, and Foxconn are building a new semiconductor assembly plant in France to produce 50 million components annually by 2033.

A new semiconductor assembly plant for specialized high-density packaging is being established in Gironde through a partnership between Foxconn, Thales, and Radiall.